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"Incorporating Multi-Chip Module Packaging Constraints into System Design."

Vivek Garg et al. (1996)

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DOI: 10.1109/EDTC.1996.494348

access: closed

type: Conference or Workshop Paper

metadata version: 2022-05-20

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  dblp key:
  - conf/date/GargLSSUWY96
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  persistent URL:
  - https://dblp.org/rec/conf/date/GargLSSUWY96
Vivek Garg, Steve Lacy, David E. Schimmel, Darrell Stogner, Craig D. Ulmer, D. Scott Wills, Sudhakar Yalamanchili:
Incorporating Multi-Chip Module Packaging Constraints into System Design. ED&TC 1996: 508-513

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