Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Placement of 3D ICs with Thermal and Interlayer Via Considerations."

Brent Goplen, Sachin S. Sapatnekar (2007)

> Home

Details and statistics

DOI: 10.1145/1278480.1278637

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/dac/GoplenS07
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/dac/GoplenS07
Brent Goplen, Sachin S. Sapatnekar:
Placement of 3D ICs with Thermal and Interlayer Via Considerations. DAC 2007: 626-631

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.