Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Interconnects in the Third Dimension: Design Challenges for 3D ICs."

Kerry Bernstein et al. (2007)

> Home

Details and statistics

DOI: 10.1145/1278480.1278623

access: closed

type: Conference or Workshop Paper

metadata version: 2021-09-19

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/dac/BernsteinACEGHIKMPY07
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/dac/BernsteinACEGHIKMPY07
Kerry Bernstein, Paul S. Andry, Jerome Cann, Philip G. Emma, David Greenberg, Wilfried Haensch, Mike Ignatowski, Steven J. Koester, John Magerlein, Ruchir Puri, Albert M. Young:
Interconnects in the Third Dimension: Design Challenges for 3D ICs. DAC 2007: 562-567

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.