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"Multi-visit TAMs to Reduce the Post-Bond Test Length of 2.5D-SICs with a ..."

Chun-Chuan Chi et al. (2011)

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DOI: 10.1109/ATS.2011.36

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-05

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  dblp key:
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Chun-Chuan Chi, Erik Jan Marinissen, Sandeep Kumar Goel, Cheng-Wen Wu:
Multi-visit TAMs to Reduce the Post-Bond Test Length of 2.5D-SICs with a Passive Silicon Interposer Base. Asian Test Symposium 2011: 451-456

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