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"A low stress bond pad design optimization of low temperature solder ..."
Xiaowu Zhang et al. (2011)
- Xiaowu Zhang, Ranjan Rajoo, F. X. Che, C. S. Selvanayagam, W. K. Choi, Shan Gao, Guo-Qiang Lo, Dim-Lee Kwong:
A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications. 3DIC 2011: 1-5
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