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"Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D ..."

Jiayi Shen et al. (2023)

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DOI: 10.1109/3DIC57175.2023.10154930

access: closed

type: Conference or Workshop Paper

metadata version: 2023-07-10

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  dblp key:
  - conf/3dic/ShenLHSKTMKF23
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  - https://dblp.org/rec/conf/3dic/ShenLHSKTMKF23
Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima:
Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last. 3DIC 2023: 1-4

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