BibTeX record journals/tcas/VaisbandF17

download as .bib file

@article{DBLP:journals/tcas/VaisbandF17,
  author       = {Boris Vaisband and
                  Eby G. Friedman},
  title        = {Hexagonal {TSV} Bundle Topology for 3-D ICs},
  journal      = {{IEEE} Trans. Circuits Syst. {II} Express Briefs},
  volume       = {64-II},
  number       = {1},
  pages        = {11--15},
  year         = {2017},
  url          = {https://doi.org/10.1109/TCSII.2016.2551552},
  doi          = {10.1109/TCSII.2016.2551552},
  timestamp    = {Wed, 27 May 2020 17:11:08 +0200},
  biburl       = {https://dblp.org/rec/journals/tcas/VaisbandF17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.