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"Hexagonal TSV Bundle Topology for 3-D ICs."

Boris Vaisband, Eby G. Friedman (2017)

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DOI: 10.1109/TCSII.2016.2551552

access: closed

type: Journal Article

metadata version: 2020-05-27

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Boris Vaisband, Eby G. Friedman:
Hexagonal TSV Bundle Topology for 3-D ICs. IEEE Trans. Circuits Syst. II Express Briefs 64-II(1): 11-15 (2017)

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