BibTeX record journals/mr/YimLLSK14

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@article{DBLP:journals/mr/YimLLSK14,
  author       = {Byung{-}seung Yim and
                  Jeong{-}Il Lee and
                  Byung{-}Hun Lee and
                  Young{-}Eui Shin and
                  Jong{-}Min Kim},
  title        = {An investigation of the reliability of solderable {ICA} with low-melting-point
                  alloy {(LMPA)} filler},
  journal      = {Microelectron. Reliab.},
  volume       = {54},
  number       = {12},
  pages        = {2944--2950},
  year         = {2014},
  url          = {https://doi.org/10.1016/j.microrel.2014.07.143},
  doi          = {10.1016/J.MICROREL.2014.07.143},
  timestamp    = {Sat, 22 Feb 2020 19:29:27 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/YimLLSK14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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