"An investigation of the reliability of solderable ICA with ..."

Byung-seung Yim et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.07.143

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type: Journal Article

metadata version: 2020-02-22

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Byung-seung Yim, Jeong-Il Lee, Byung-Hun Lee, Young-Eui Shin, Jong-Min Kim:
An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler. Microelectron. Reliab. 54(12): 2944-2950 (2014)

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