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"An investigation of the reliability of solderable ICA with ..."
Byung-seung Yim et al. (2014)
- Byung-seung Yim
, Jeong-Il Lee, Byung-Hun Lee, Young-Eui Shin, Jong-Min Kim:
An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler. Microelectron. Reliab. 54(12): 2944-2950 (2014)
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