BibTeX record journals/ieiceee/YangZDZMZ16

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@article{DBLP:journals/ieiceee/YangZDZMZ16,
  author       = {Yintang Yang and
                  Junping Zheng and
                  Gang Dong and
                  Yingbo Zhao and
                  Zheng Mei and
                  Weijun Zhu},
  title        = {New coaxial through silicon via {(TSV)} applied for three dimensional
                  integrated circuits {(3D} ICs)},
  journal      = {{IEICE} Electron. Express},
  volume       = {13},
  number       = {8},
  pages        = {20160192},
  year         = {2016},
  url          = {https://doi.org/10.1587/elex.13.20160192},
  doi          = {10.1587/ELEX.13.20160192},
  timestamp    = {Fri, 12 Feb 2021 22:21:06 +0100},
  biburl       = {https://dblp.org/rec/journals/ieiceee/YangZDZMZ16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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