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"New coaxial through silicon via (TSV) applied for three dimensional ..."

Yintang Yang et al. (2016)

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DOI: 10.1587/ELEX.13.20160192

access: open

type: Journal Article

metadata version: 2021-02-12

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  - https://dblp.org/rec/journals/ieiceee/YangZDZMZ16
Yintang Yang, Junping Zheng, Gang Dong, Yingbo Zhao, Zheng Mei, Weijun Zhu:
New coaxial through silicon via (TSV) applied for three dimensional integrated circuits (3D ICs). IEICE Electron. Express 13(8): 20160192 (2016)

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