BibTeX record conf/isscc/ChangHCWLCCCHLWCCT13

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@inproceedings{DBLP:conf/isscc/ChangHCWLCCCHLWCCT13,
  author       = {Chih{-}Wei Chang and
                  Po{-}Tsang Huang and
                  Lei{-}Chun Chou and
                  Shang{-}Lin Wu and
                  Shih{-}Wei Lee and
                  Ching{-}Te Chuang and
                  Kuan{-}Neng Chen and
                  Jin{-}Chern Chiou and
                  Wei Hwang and
                  Yen{-}Chi Lee and
                  Chung{-}Hsi Wu and
                  Kuo{-}Hua Chen and
                  Chi{-}Tsung Chiu and
                  Ho{-}Ming Tong},
  title        = {Through-silicon-via-based double-side integrated microsystem for neural
                  sensing applications},
  booktitle    = {2013 {IEEE} International Solid-State Circuits Conference - Digest
                  of Technical Papers, {ISSCC} 2013, San Francisco, CA, USA, February
                  17-21, 2013},
  pages        = {102--103},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/ISSCC.2013.6487655},
  doi          = {10.1109/ISSCC.2013.6487655},
  timestamp    = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl       = {https://dblp.org/rec/conf/isscc/ChangHCWLCCCHLWCCT13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}