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"Through-silicon-via-based double-side integrated microsystem for neural ..."

Chih-Wei Chang et al. (2013)

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DOI: 10.1109/ISSCC.2013.6487655

access: closed

type: Conference or Workshop Paper

metadata version: 2017-09-16

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  dblp key:
  - conf/isscc/ChangHCWLCCCHLWCCT13
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  - https://dblp.org/rec/conf/isscc/ChangHCWLCCCHLWCCT13
Chih-Wei Chang, Po-Tsang Huang, Lei-Chun Chou, Shang-Lin Wu, Shih-Wei Lee, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, Yen-Chi Lee, Chung-Hsi Wu, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong:
Through-silicon-via-based double-side integrated microsystem for neural sensing applications. ISSCC 2013: 102-103

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