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Martin R. Corfield

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affiliation: University of Nottingham, Department of Electrical and Electronic Engineering, UK

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2016
[j3]
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  dblp key:
  - journals/mr/ArjmandACLMJ16
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  persistent URL:
  - https://dblp.org/rec/journals/mr/ArjmandACLMJ16
Elaheh Arjmand, Pearl A. Agyakwa, Martin R. Corfield, Jianfeng Li, Bassem Mouawad, C. Mark Johnson:
A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectron. Reliab. 59: 126-133 (2016)
2012
[j2]
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  dblp key:
  - journals/mr/DangCCJW12
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  - https://dblp.org/rec/journals/mr/DangCCJW12
H. Q. S. Dang, Martin R. Corfield, Alberto Castellazzi, C. Mark Johnson, Patrick Wheeler:
Repetitive high peak current pulsed discharge film-capacitor reliability testing. Microelectron. Reliab. 52(9-10): 2301-2305 (2012)
2011
[j1]
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  dblp key:
  - journals/mr/AgyakwaCYLMJ11
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  - https://dblp.org/rec/journals/mr/AgyakwaCYLMJ11
Pearl A. Agyakwa, Martin R. Corfield, Li Yang, Jianfeng Li, V. M. F. Marques, C. Mark Johnson:
Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling. Microelectron. Reliab. 51(2): 406-415 (2011)

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