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Jae B. Kwak

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2010 – 2019

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2010
[j2]
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Tung T. Nguyen, Donggun Lee, Jae B. Kwak, Seungbae Park:
Effect of glue on reliability of flip chip BGA packages under thermal cycling. Microelectron. Reliab. 50(7): 1000-1006 (2010)
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Da Yu, Jae B. Kwak, Seungbae Park, John Lee:
Dynamic responses of PCB under product-level free drop impact. Microelectron. Reliab. 50(7): 1028-1038 (2010)

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