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Wang Gu Lee

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2010 – 2019

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2011
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Sung Chul Hong, Wang Gu Lee, Won Joong Kim, Jong Hyeong Kim, Jae Pil Jung:
Reduction of defects in TSV filled with Cu by high-speed 3-step PPR for 3D Si chip stacking. Microelectron. Reliab. 51(12): 2228-2235 (2011)

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