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Jane Y. N. Tan

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2006
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Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low:
Drop impact reliability testing for lead-free and lead-based soldered IC packages. Microelectron. Reliab. 46(7): 1160-1171 (2006)

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