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Y. Kanameda

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2010
[j1]
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L. Sauter, A. Seekamp, Y. Shibata, Y. Kanameda, H. Yamashita:
Whisker mitigation measures for Sn-plated Cu for different stress tests. Microelectron. Reliab. 50(9-11): 1631-1635 (2010)

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