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A. Nowodzinski

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Conference and Workshop Papers

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2014
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Yann Beilliard, Stéphane Moreau, Léa Di Cioccio, Perceval Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix:
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO₂ direct hybrid bonding. 3DIC 2014: 1-8

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