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"Advances toward reliable high density Cu-Cu interconnects by ..."
Yann Beilliard et al. (2014)
- Yann Beilliard
, Stéphane Moreau
, Léa Di Cioccio, Perceval Coudrain
, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix:
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding. 3DIC 2014: 1-8
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