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Allen W.-T. Chen

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2013
[j1]
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Christina C.-H. Liao, Allen W.-T. Chen, Louis Y.-Z. Lin, Charles H.-P. Wen:
Fast Scan-Chain Ordering for 3-D-IC Designs Under Through-Silicon-Via (TSV) Constraints. IEEE Trans. Very Large Scale Integr. Syst. 21(6): 1170-1174 (2013)

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