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Chun-Chih Chuang

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Journal Articles

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2008
[j1]
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  - journals/mr/ChuangYJHZLLCC08
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  - https://dblp.org/rec/journals/mr/ChuangYJHZLLCC08
Chun-Chih Chuang, Tsung-Fu Yang, Jin-Ye Juang, Yin-Po Hung, Chau-Jie Zhan, Yu-Min Lin, Ching-Tsung Lin, Pei-Chen Chang, Tao-Chih Chang:
Influence of underfill materials on the reliability of coreless flip chip package. Microelectron. Reliab. 48(11-12): 1875-1881 (2008)

Conference and Workshop Papers

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2015
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Ang Lu, Hsueh-Ju Lu, En-Jang Jang, Yu-Po Lin, Chun-Hsiang Hung, Chun-Chih Chuang, Rung-Bin Lin:
Simultaneous transistor pairing and placement for CMOS standard cells. DATE 2015: 1647-1652

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