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Mikael Detalle
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2010 – 2019
- 2016
- [c9]C. Roda Neve, Mikael Detalle, Philip Nolmans, Yunlong Li, Joeri De Vos, Geert Van der Plas, Gerald Beyer, Eric Beyne
:
High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer. 3DIC 2016: 1-4 - 2015
- [c8]Dimitrios Velenis, Mikael Detalle, Geert Hellings, Mirko Scholz, Erik Jan Marinissen
, Geert Van der Plas
, Antonio La Manna, Andy Miller, Dimitri Linten, Eric Beyne
:
Processing active devices on Si interposer and impact on cost. 3DIC 2015: TS11.2.1-TS11.2.4 - [c7]Geert Hellings, Mirko Scholz, Mikael Detalle, Dimitrios Velenis, Muriel de Potter de ten Broeck, C. Roda Neve, Y. Li, Stefaan Van Huylenbroeck, Shih-Hung Chen, Erik Jan Marinissen
, Antonio La Manna, Geert Van der Plas, Dimitri Linten, Eric Beyne
, Aaron Thean:
Active-lite interposer for 2.5 & 3D integration. VLSIC 2015: 222- - 2014
- [c6]X. Sun, Geert Van der Plas, Mikael Detalle, Eric Beyne
:
Analysis of 3D interconnect performance: Effect of the Si substrate resistivity. 3DIC 2014: 1-4 - [c5]Joeri De Vos, Vladimir Cherman, Mikael Detalle, Teng Wang, Abdellah Salahouelhadj, Robert Daily, Geert Van der Plas
, Eric Beyne
:
Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges. 3DIC 2014: 1-7 - 2013
- [c4]Dimitrios Velenis, Mikael Detalle, Erik Jan Marinissen
, Eric Beyne
:
Si interposer build-up options and impact on 3D system cost. 3DIC 2013: 1-5 - 2012
- [c3]Jaemin Kim, Sunyoung Kim, Julien Ryckaert, Mikael Detalle, Nele Van Hoovels, Pol Marchal:
A calibrated pathfinding model for signal integrity analysis on interposer. CICC 2012: 1-4 - 2011
- [c2]Andrej Ivankovic, Geert Van der Plas
, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, Wenqi Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne
, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte:
Analysis of microbump induced stress effects in 3D stacked IC technologies. 3DIC 2011: 1-5 - [c1]Antonio La Manna, Dimitrios Velenis, Thibault Buisson, Mikael Detalle, Kenneth J. Rebibis, Wenqi Zhang, Eric Beyne
:
3D stacking using ultra thin dies. 3DIC 2011: 1-5
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