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"Analysis of 3D interconnect performance: Effect of the Si substrate ..."

X. Sun et al. (2014)

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DOI: 10.1109/3DIC.2014.7152156

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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X. Sun, Geert Van der Plas, Mikael Detalle, Eric Beyne:
Analysis of 3D interconnect performance: Effect of the Si substrate resistivity. 3DIC 2014: 1-4

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