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K. S. Chang-Liao

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2006
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Robin C. J. Wang, C. C. Lee, L. D. Chen, Kenneth Wu, K. S. Chang-Liao:
A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect. Microelectron. Reliab. 46(9-11): 1673-1678 (2006)

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