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Publication search results
found 11 matches
- 2018
- Kyeonggon Choi, Dong-Youl Yu, Sungdo Ahn, Kyoung-Ho Kim, Jung-Hwan Bang, Yong-Ho Ko:
Joint reliability of various Pb-free solders under harsh vibration conditions for automotive electronics. Microelectron. Reliab. 86: 66-71 (2018) - Wasma Hanini, Moez Ayadi:
Electro thermal modeling of the power diode using Pspice. Microelectron. Reliab. 86: 82-91 (2018) - Marcin Janicki, Tomasz Torzewicz, Agnieszka Samson, Tomasz Raszkowski, Andrzej Napieralski:
Experimental identification of LED compact thermal model element values. Microelectron. Reliab. 86: 20-26 (2018) - Stefan Kristofík, Marcel Baláz, Peter Malík:
Hardware redundancy architecture based on reconfigurable logic blocks with persistent high reliability improvement. Microelectron. Reliab. 86: 38-53 (2018) - Ting Li, Zebin Li, Ke Zhao, Boan Pan, Zhiyuan Wang, Xiping Yang:
Reliability analysis of a mini-instrument for simultaneous monitoring water content, deep tissue temperature, and hemodynamic parameters. Microelectron. Reliab. 86: 72-76 (2018) - Jorge Martínez, Mert Atamaner, Pedro Reviriego, Oguz Ergin, Marco Ottavi:
Opcode vector: An efficient scheme to detect soft errors in instructions. Microelectron. Reliab. 86: 92-97 (2018) - Riikka Mikkonen, Matti Mäntysalo:
Evaluation of screen printed silver trace performance and long-term reliability against environmental stress on a low surface energy substrate. Microelectron. Reliab. 86: 54-65 (2018) - Nam Nguyen, Van-Quyen Dinh, Tung Nguyen-Duc, Quoc-Tuan Ta, Xuan-Viet Dao, Thanh-Huy Pham, Trung-Kien Nguyen-Duc:
Effect of potting materials on LED bulb's driver temperature. Microelectron. Reliab. 86: 77-81 (2018) - Tomasz Raszkowski, Agnieszka Samson, Mariusz Zubert:
Influence of temperature and heat flux time lags on the temperature distribution in modern GAAFET structure based on Dual-Phase-Lag thermal model. Microelectron. Reliab. 86: 10-19 (2018) - Yongqiang Wan, Shuang Li, Xiaowu Hu, Yu Qiu, Tao Xu, Yulong Li, Xiongxin Jiang:
Shear strength and fracture surface analysis of Sn58Bi/Cu solder joints under a wide range of strain rates. Microelectron. Reliab. 86: 27-37 (2018) - Thomas Wlanis, René Hammer, Werner Ecker, Sandrine Lhostis, Clément Sart, Sébastien Gallois-Garreignot, Bernhard Rebhan, Günther A. Maier:
Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach. Microelectron. Reliab. 86: 1-9 (2018)
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