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export results for "toc:db/conf/hotchips/hotchips2023.bht:"
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@inproceedings{DBLP:conf/hotchips/Bruce23,
author = {Magnus Bruce},
title = {Arm Neoverse {V2} platform: Leadership Performance and Power Efficiency
for Next-Generation Cloud Computing, {ML} and {HPC} Workloads},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--25},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254718},
doi = {10.1109/HCS59251.2023.10254718},
timestamp = {Tue, 03 Oct 2023 19:13:28 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/Bruce23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/Dally23,
author = {Bill Dally},
title = {Hardware for Deep Learning},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--58},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254716},
doi = {10.1109/HCS59251.2023.10254716},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/Dally23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/DeanV23,
author = {Jeff Dean and
Amin Vahdat},
title = {Exciting Directions for {ML} Models and the Implications for Computing
Hardware},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--87},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254704},
doi = {10.1109/HCS59251.2023.10254704},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/DeanV23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/Deierling23,
author = {Kevin Deierling},
title = {NVIDIA's Resource Transmutable Network Processing {ASIC}},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--14},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254697},
doi = {10.1109/HCS59251.2023.10254697},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/Deierling23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/DhruvanarayanB23,
author = {Srivi Dhruvanarayan and
Victor Bittorf},
title = {MLSoC\({}^{\mbox{{\texttrademark}}}\) - An Overview},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--13},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254705},
doi = {10.1109/HCS59251.2023.10254705},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/DhruvanarayanB23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/Esposito23,
author = {Ben Esposito},
title = {Intel Agilex{\textregistered} 9 Direct RF-Series FPGAs with Integrated
64 Gsps Data Converters},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--35},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254707},
doi = {10.1109/HCS59251.2023.10254707},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/Esposito23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/Gaitonde23,
author = {Dinesh Gaitonde},
title = {{AMD} Next-Generation {FPGA} Built from Chiplets},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--28},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254722},
doi = {10.1109/HCS59251.2023.10254722},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/Gaitonde23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/Gianos23,
author = {Chris Gianos},
title = {Architecting for Flexibility and Value with Next Gen Intel{\textregistered}
Xeon{\textregistered} Processors},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--15},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254694},
doi = {10.1109/HCS59251.2023.10254694},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/Gianos23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/GuoKMNLCAAABCFLPPSSTWYFPNPN23,
author = {Felicia Guo and
Nayiri Krzysztofowicz and
Alex Moreno and
Jeffrey Ni and
Daniel Lovell and
Yufeng Chi and
Kareem Ahmad and
Sherwin Afshar and
Josh Alexander and
Dylan Brater and
Cheng Cao and
Daniel Fan and
Ryan Lund and
Jackson Paddock and
Griffin Prechter and
Troy Sheldon and
Shreesha Sreedhara and
Anson Tsai and
Eric Wu and
Kerry Yu and
Daniel Fritchman and
Aviral Pandey and
Ali Niknejad and
Kristofer S. J. Pister and
Borivoje Nikolic},
title = {A Heterogeneous SoC for Bluetooth {LE} in 28nm},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--11},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254696},
doi = {10.1109/HCS59251.2023.10254696},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/GuoKMNLCAAABCFLPPSSTWYFPNPN23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/Howard23,
author = {Jason Howard},
title = {The First Direct Mesh-to-Mesh Photonic Fabric},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--17},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254719},
doi = {10.1109/HCS59251.2023.10254719},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/Howard23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/JouppiS23,
author = {Norman P. Jouppi and
Andy Swing},
title = {A Machine Learning Supercomputer with an Optically Reconfigurable
Interconnect and Embeddings Support},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--24},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254691},
doi = {10.1109/HCS59251.2023.10254691},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/JouppiS23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/KimRSLKCKKKPKCLJLLSLCYS23,
author = {Jin Hyun Kim and
Yuhwan Ro and
Jinin So and
Sukhan Lee and
Shinhaeng Kang and
YeonGon Cho and
Hyeonsu Kim and
Byeongho Kim and
Kyungsoo Kim and
Sangsoo Park and
Jin{-}Seong Kim and
Sanghoon Cha and
Won{-}Jo Lee and
Jin Jung and
Jonggeon Lee and
Jieun Lee and
Joon{-}Ho Song and
Seungwon Lee and
Jeonghyeon Cho and
Jaehoon Yu and
Kyomin Sohn},
title = {Samsung {PIM/PNM} for Transfmer Based {AI} : Energy Efficiency on
{PIM/PNM} Cluster},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--31},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254711},
doi = {10.1109/HCS59251.2023.10254711},
timestamp = {Wed, 01 May 2024 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/KimRSLKCKKKPKCLJLLSLCYS23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/Kona23,
author = {Anitha Kona},
title = {{CSS} {N2:} Arm Neoverse {N2} Platform, Delivered to Partners as a
Fully Verified, Customizable Subsystem},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--23},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254706},
doi = {10.1109/HCS59251.2023.10254706},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/Kona23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/KwonKKSWJCASYKKKPPSYLPLLKKJKLC23,
author = {Yongkee Kwon and
Guhyun Kim and
Nahsung Kim and
Woojae Shin and
Jongsoon Won and
Hyunha Joo and
Haerang Choi and
Byeongju An and
Gyeongcheol Shin and
Dayeon Yun and
Jeongbin Kim and
Changhyun Kim and
Ilkon Kim and
Jaehan Park and
Chanwook Park and
Yosub Song and
Byeongsu Yang and
Hyeongdeok Lee and
Seungyeong Park and
Wonjun Lee and
Seongju Lee and
Kyuyoung Kim and
Daehan Kwon and
Chunseok Jeong and
John Kim and
Euicheol Lim and
Junhyun Chun},
title = {Memory-Centric Computing with {SK} Hynix's Domain-Specific Memory},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--26},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254717},
doi = {10.1109/HCS59251.2023.10254717},
timestamp = {Thu, 05 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/KwonKKSWJCASYKKKPPSYLPLLKKJKLC23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/Lie23,
author = {Sean Lie},
title = {Inside the Cerebras Wafer-Scale Cluster: Cerebras Systems},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--41},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254700},
doi = {10.1109/HCS59251.2023.10254700},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/Lie23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/Mahurin23,
author = {Eric Mahurin},
title = {Qualocmm{\textregistered} Hexagon{\texttrademark} {NPU}},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--19},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254715},
doi = {10.1109/HCS59251.2023.10254715},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/Mahurin23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/ModhaAAAACDDEOSTABCFGGIKKMMNNRSSSS23,
author = {Dharmendra S. Modha and
Filipp Akopyan and
Alexander Andreopoulos and
Rathinakumar Appuswamy and
John V. Arthur and
Andrew S. Cassidy and
Pallab Datta and
Michael V. DeBole and
Steven K. Esser and
Carlos Ortega Otero and
Jun Sawada and
Brian Taba and
Arnon Amir and
Deepika Bablani and
Peter J. Carlson and
Myron D. Flickner and
Rajamohan Gandhasri and
Guillaume Garreau and
Megumi Ito and
Jennifer L. Klamo and
Jeffrey A. Kusnitz and
Nathaniel J. McClatchey and
Jeffrey L. McKinstry and
Yutaka Y. Nakamura and
Tapan K. Nayak and
William P. Risk and
Kai Schleupen and
Ben Shaw and
Jay Sivagnaname and
Daniel F. Smith and
Ignacio Terrizzano and
Takanori Ueda},
title = {{IBM} NorthPole Neural Inference Machine},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--58},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254721},
doi = {10.1109/HCS59251.2023.10254721},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/ModhaAAAACDDEOSTABCFGGIKKMMNNRSSSS23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/MoonKKCCHK23,
author = {Seungjae Moon and
Junsoo Kim and
Jung{-}Hoon Kim and
Junseo Cha and
Gyubin Choi and
Seongmin Hong and
Joo{-}Young Kim},
title = {HyperAccel Latency Processing Unit (LPU\({}^{\mbox{TM}}\)) Accelerating
Hyperscale Models for Generative {AI}},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254693},
doi = {10.1109/HCS59251.2023.10254693},
timestamp = {Tue, 05 Mar 2024 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/hotchips/MoonKKCCHK23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/Rotem23,
author = {Efraim Rotem},
title = {Intel{\textregistered} Energy Efficiency Architecture},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--17},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254695},
doi = {10.1109/HCS59251.2023.10254695},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/Rotem23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/ShiLWTCCWLZWXM23,
author = {Guiming Shi and
Yi Li and
Xueqiang Wang and
Zhanhong Tan and
Dapeng Cao and
Jingwei Cai and
Yuchen Wei and
Zehua Li and
Wuke Zhang and
Yifu Wu and
Wei Xu and
Kaisheng Ma},
title = {{PHEP:} Paillier Homomorphic Encryption Processors for Privacy-Preserving
Applications in Cloud Computing},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--20},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254692},
doi = {10.1109/HCS59251.2023.10254692},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/ShiLWTCCWLZWXM23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/SoltisR23,
author = {Don Soltis and
Stephen Robinson},
title = {The Next Generation of High Performance, Energy-Efficient Computing:
Intel{\textregistered} Xeon{\textregistered} Processors Built on Efficient-Core},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--16},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254709},
doi = {10.1109/HCS59251.2023.10254709},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/SoltisR23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/SpracklenA23,
author = {Lawrence Spracklen and
Subutai Ahmad},
title = {Supercharged {AI} Inference on Modern CPUs},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--21},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254702},
doi = {10.1109/HCS59251.2023.10254702},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/SpracklenA23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/Steinman23,
author = {Maurice Steinman},
title = {Hummingbird{\texttrademark} Low-Latency Computing Engine},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--20},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254714},
doi = {10.1109/HCS59251.2023.10254714},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/Steinman23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/SubramonKP23,
author = {Mahesh Subramon and
David Kramer and
Indrani Paul},
title = {{AMD} Ryzen\({}^{\mbox{{\texttrademark}}}\) 7040 Series: Technology
Overview},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--27},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254701},
doi = {10.1109/HCS59251.2023.10254701},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/SubramonKP23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/TanWZSZM23,
author = {Zhanhong Tan and
Yifu Wu and
Yannian Zhang and
Haobing Shi and
Wuke Zhang and
Kaisheng Ma},
title = {A Scalable Multi-Chiplet Deep Learning Accelerator with Hub-Side 2.5D
Heterogeneous Integration},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--17},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254703},
doi = {10.1109/HCS59251.2023.10254703},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/TanWZSZM23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/TroesterB23,
author = {Kai Troester and
Ravi Bhargava},
title = {{AMD} Next Generation "Zen 4" Core and 4th Gen {AMD} EPYC{\texttrademark}
9004 Server {CPU}},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--25},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254726},
doi = {10.1109/HCS59251.2023.10254726},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/TroesterB23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/ValenteVSTNWSGPTKLSPPBMR23,
author = {Luca Valente and
A. Veeran and
Mattia Sinigaglia and
Yvan Tortorella and
Alessandro Nadalini and
Nils Wistoff and
Bruno S{\'{a}} and
Angelo Garofalo and
Rafail Psiakis and
M. Tolba and
Ari Kulmala and
Nimisha Limaye and
Ozgur Sinanoglu and
Sandro Pinto and
Daniele Palossi and
Luca Benini and
Baker Mohammad and
Davide Rossi},
title = {Shaheen: An Open, Secure, and Scalable {RV64} SoC for Autonomous Nano-UAVs},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--12},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254698},
doi = {10.1109/HCS59251.2023.10254698},
timestamp = {Mon, 05 Feb 2024 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/hotchips/ValenteVSTNWSGPTKLSPPBMR23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/WadeSSSTMS23,
author = {Mark Wade and
Chen Sun and
Matthew Sysak and
Vladimir Stojanovic and
Pooya Tadayon and
Ravi Mahajan and
Babak Sabi},
title = {Driving Compute Scale-out Performance with Optical {I/O} Chiplets
in Advanced System-in-Package Platforms},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254699},
doi = {10.1109/HCS59251.2023.10254699},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/WadeSSSTMS23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/WinfieldMOMR23,
author = {Ian Winfield and
Joseph Madril and
Tim Ouradnik and
Michael Matthews and
Guillermo Romero},
title = {{FABRIC8LABS:} Electrochemical Additive Manufacturing {(ECAM)} For
Cooling High Performance ICs},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--18},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254724},
doi = {10.1109/HCS59251.2023.10254724},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/WinfieldMOMR23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/hotchips/Xiao23,
author = {Zhibin Xiao},
title = {Moffett Antoum\({}^{\mbox{{\textregistered}}}\): {A} Deep-Sparse {AI}
Inference System-on-Chip for Vision and Large-language Models},
booktitle = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
pages = {1--33},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023.10254723},
doi = {10.1109/HCS59251.2023.10254723},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/Xiao23.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/hotchips/2023,
title = {35th {IEEE} Hot Chips Symposium, {HCS} 2023, Palo Alto, CA, USA, August
27-29, 2023},
publisher = {{IEEE}},
year = {2023},
url = {https://doi.org/10.1109/HCS59251.2023},
doi = {10.1109/HCS59251.2023},
isbn = {979-8-3503-3907-9},
timestamp = {Tue, 03 Oct 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/hotchips/2023.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
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