"Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs."

Brandon Noia (2014)

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type: Book or Thesis

metadata version: 2022-05-04

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Brandon Noia:
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs. Duke University, Durham, NC, USA, 2014

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