"A Percolative Approach to Reliability of Thin Film Interconnects and ..."

C. Pennetta et al. (2001)

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DOI: 10.1155/2001/38657

access: open

type: Journal Article

metadata version: 2023-08-02

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C. Pennetta, Luca Reggiani, G. Trefán, R. Cataldo, Giorgio De Nunzio:
A Percolative Approach to Reliability of Thin Film Interconnects and Ultra-thin Dielectrics. VLSI Design 13(1-4): 363-367 (2001)

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