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"Experimental Analysis of Thermal Coupling in 3-D Integrated Circuits."

Ioannis Savidis, Boris Vaisband, Eby G. Friedman (2015)

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DOI: 10.1109/TVLSI.2014.2357441

access: closed

type: Journal Article

metadata version: 2020-03-11

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Ioannis Savidis, Boris Vaisband, Eby G. Friedman:
Experimental Analysis of Thermal Coupling in 3-D Integrated Circuits. IEEE Trans. Very Large Scale Integr. Syst. 23(10): 2077-2089 (2015)

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