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"A Novel Thermal-Aware Floorplanning and TSV Assignment With Game Theory ..."

Wenbo Guan et al. (2023)

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DOI: 10.1109/TVLSI.2023.3309595

access: closed

type: Journal Article

metadata version: 2023-10-27

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  - https://dblp.org/rec/journals/tvlsi/GuanTLZZ23
Wenbo Guan, Xiaoyan Tang, Hongliang Lu, Yuming Zhang, Yimen Zhang:
A Novel Thermal-Aware Floorplanning and TSV Assignment With Game Theory for Fixed-Outline 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 31(11): 1639-1652 (2023)

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