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"Simulation Methodology and Evaluation of Through Silicon Via (TSV)-FinFET ..."

Brad D. Gaynor, Soha Hassoun (2015)

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DOI: 10.1109/TVLSI.2014.2341834

access: closed

type: Journal Article

metadata version: 2020-03-11

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  - https://dblp.org/rec/journals/tvlsi/GaynorH15
Brad D. Gaynor, Soha Hassoun:
Simulation Methodology and Evaluation of Through Silicon Via (TSV)-FinFET Noise Coupling in 3-D Integrated Circuits. IEEE Trans. Very Large Scale Integr. Syst. 23(8): 1499-1507 (2015)

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