"A Novel Hybrid Delay Unit Based on Dummy TSVs for 3-D On-Chip Memory."

Xiaowei Chen et al. (2018)

Details and statistics

DOI: 10.1109/TVLSI.2018.2809961

access: closed

type: Journal Article

metadata version: 2020-09-05

a service of  Schloss Dagstuhl - Leibniz Center for Informatics