Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Thermomechanical Reliabilities of Pb-Free Solder Joints According to Ag ..."

Jemin Kim, Dongweon Yoon (2023)

> Home

Details and statistics

DOI: 10.1109/TR.2023.3256405

access: closed

type: Journal Article

metadata version: 2023-12-31

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tr/KimY23
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tr/KimY23
Jemin Kim, Dongweon Yoon:
Thermomechanical Reliabilities of Pb-Free Solder Joints According to Ag Content in Harsh Environment. IEEE Trans. Reliab. 72(4): 1610-1618 (2023)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.