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"Multicast Testing of Interposer-Based 2.5D ICs: Test-Architecture Design ..."

Shengcheng Wang et al. (2018)

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DOI: 10.1145/3177879

access: closed

type: Journal Article

metadata version: 2022-01-08

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Shengcheng Wang, Ran Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori:
Multicast Testing of Interposer-Based 2.5D ICs: Test-Architecture Design and Test Scheduling. ACM Trans. Design Autom. Electr. Syst. 23(3): 35:1-35:25 (2018)

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