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"Multi-Stage Machine Learning Model for Hierarchical Tie Valence Prediction."

Karandeep Singh et al. (2023)

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DOI: 10.1145/3579096

access: closed

type: Journal Article

metadata version: 2023-05-17

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  - https://dblp.org/rec/journals/tkdd/SinghLLFC23
Karandeep Singh, SeungEon Lee, Giuseppe (Joe) Labianca, Jesse Michael Fagan, Meeyoung Cha:
Multi-Stage Machine Learning Model for Hierarchical Tie Valence Prediction. ACM Trans. Knowl. Discov. Data 17(6): 83:1-83:20 (2023)

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