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"A Method for Deembedding the Mounting Pad and Via-Hole Effect in a Test ..."

Sanguk Lee et al. (2024)

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DOI: 10.1109/TIM.2024.3394503

access: closed

type: Journal Article

metadata version: 2024-05-31

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Sanguk Lee, Hyunwoong Kim, Jangyong Ahn, Jaewon Rhee, Jaeyong Cho, Hongseok Kim, Seungyoung Ahn:
A Method for Deembedding the Mounting Pad and Via-Hole Effect in a Test Fixture for Accurate Impedance Measurement of the Surface Mount Device Component. IEEE Trans. Instrum. Meas. 73: 1-13 (2024)

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