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"Nondestructive analysis of interconnection in two-die BGA using TDR."
Ming-Kun Chen, Cheng-Chi Tai, Yu-Jung Huang (2006)
- Ming-Kun Chen, Cheng-Chi Tai, Yu-Jung Huang:
Nondestructive analysis of interconnection in two-die BGA using TDR. IEEE Trans. Instrum. Meas. 55(2): 400-405 (2006)
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