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"Detection of Micro Solder Balls Using Active Thermography Technology and ..."

Xiangning Lu et al. (2018)

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DOI: 10.1109/TII.2018.2839614

access: closed

type: Journal Article

metadata version: 2020-05-21

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  - https://dblp.org/rec/journals/tii/LuHSFLLS18
Xiangning Lu, Zhenzhi He, Lei Su, Mengying Fan, Fan Liu, Guanglan Liao, Tielin Shi:
Detection of Micro Solder Balls Using Active Thermography Technology and K-Means Algorithm. IEEE Trans. Ind. Informatics 14(12): 5620-5628 (2018)

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