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"The Mathematical Model and Novel Final Test System for Wafer-Level Packaging."

Junhui Li et al. (2017)

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DOI: 10.1109/TII.2016.2643694

access: closed

type: Journal Article

metadata version: 2020-05-21

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  - journals/tii/LiTLZLZ17
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  - https://dblp.org/rec/journals/tii/LiTLZLZ17
Junhui Li, Wenya Tian, Hailong Liao, Can Zhou, Xiaohe Liu, Wenhui Zhu:
The Mathematical Model and Novel Final Test System for Wafer-Level Packaging. IEEE Trans. Ind. Informatics 13(4): 1817-1824 (2017)

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