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"A VCM Active Actuation Method for Bonding Time Reduction in Chip Packaging ..."
Lanyu Zhang et al. (2021)
- Lanyu Zhang
, Jian Gao
, Yunbo He
, Xin Chen
, Yun Chen
, Hui Tang
, Zhijun Yang
:
A VCM Active Actuation Method for Bonding Time Reduction in Chip Packaging Process. IEEE Trans. Ind. Electron. 68(8): 7252-7262 (2021)
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