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"High-Precision Thickness Measurement of Cu Film on Si-Based Wafer Using ..."

Zilian Qu et al. (2022)

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DOI: 10.1109/TIE.2021.3111570

access: closed

type: Journal Article

metadata version: 2022-04-27

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  - journals/tie/QuWYBZ22
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  - https://dblp.org/rec/journals/tie/QuWYBZ22
Zilian Qu, Wensong Wang, Zhengchun Yang, Qiwen Bao, Yuanjin Zheng:
High-Precision Thickness Measurement of Cu Film on Si-Based Wafer Using Erasable Printed Eddy Current Coil and High-Sensitivity Associated Circuit Techniques. IEEE Trans. Ind. Electron. 69(9): 9556-9565 (2022)

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