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"A Highly Manufacturable Large Area Array MEMS Probe Card Using ..."

Bong-Hwan Kim, Jong-Bok Kim, Jong-Hyun Kim (2009)

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DOI: 10.1109/TIE.2008.2003366

access: closed

type: Journal Article

metadata version: 2020-05-22

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Bong-Hwan Kim, Jong-Bok Kim, Jong-Hyun Kim:
A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Flipchip Bonding. IEEE Trans. Ind. Electron. 56(4): 1079-1085 (2009)

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