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"Fatigue Mechanism of Die-Attach Joints in IGBTs Under Low-Amplitude ..."

Yongle Huang et al. (2021)

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DOI: 10.1109/TIE.2020.2977563

access: closed

type: Journal Article

metadata version: 2021-01-09

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Yongle Huang, Hongfei Deng, Yifei Luo, Fei Xiao, Binli Liu, Xin Tang:
Fatigue Mechanism of Die-Attach Joints in IGBTs Under Low-Amplitude Temperature Swings Based on 3D Electro-Thermal-Mechanical FE Simulations. IEEE Trans. Ind. Electron. 68(4): 3033-3043 (2021)

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