Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"An SiC-Based Half-Bridge Module With an Improved Hybrid Packaging Method ..."

Cai Chen et al. (2017)

> Home

Details and statistics

DOI: 10.1109/TIE.2017.2723873

access: closed

type: Journal Article

metadata version: 2020-05-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tie/ChenCLHLK17
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tie/ChenCLHLK17
Cai Chen, Yu Chen, Yuxiong Li, Zhizhao Huang, Teng Liu, Yong Kang:
An SiC-Based Half-Bridge Module With an Improved Hybrid Packaging Method for High Power Density Applications. IEEE Trans. Ind. Electron. 64(11): 8980-8991 (2017)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.