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"Network-on-Chip Multicast Architectures Using Hybrid Wire and Surface-Wave ..."

Ammar Karkar et al. (2018)

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DOI: 10.1109/TETC.2016.2551043

access: closed

type: Journal Article

metadata version: 2020-12-29

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  persistent URL:
  - https://dblp.org/rec/journals/tetc/KarkarMDATY18
Ammar Karkar, Terrence S. T. Mak, Nizar Dahir, Ra'ed Al-Dujaily, Kin-Fai Tong, Alex Yakovlev:
Network-on-Chip Multicast Architectures Using Hybrid Wire and Surface-Wave Interconnects. IEEE Trans. Emerg. Top. Comput. 6(3): 357-369 (2018)

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