"Monitoring Thermal Stress in Wafer-Scale Integrated Circuits by the ..."

Ahmed Lakhssassi et al. (2016)

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DOI: 10.1109/TCSVT.2015.2409632

access: closed

type: Journal Article

metadata version: 2020-08-25

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Ahmed Lakhssassi, Roman Palenychka, Yvon Savaria, Michel Sayde, Marek B. Zaremba:
Monitoring Thermal Stress in Wafer-Scale Integrated Circuits by the Attentive Vision Method Using an Infrared Camera. IEEE Trans. Circuits Syst. Video Technol. 26(2): 412-424 (2016)

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