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"Compact Planar W-Band Front-End Module Based on EBG Packaging and LTCC ..."

Yongrong Shi et al. (2021)

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DOI: 10.1109/TCSII.2020.3022858

access: closed

type: Journal Article

metadata version: 2022-08-15

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  - https://dblp.org/rec/journals/tcasII/ShiFWZZW21
Yongrong Shi, Wenjie Feng, Hui Wang, Shichao Zheng, Ming Zhou, Qihui Wu:
Compact Planar W-Band Front-End Module Based on EBG Packaging and LTCC Circuits. IEEE Trans. Circuits Syst. II Express Briefs 68(3): 878-882 (2021)

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