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"Efficient Thermal Simulation for 3-D IC With Thermal Through-Silicon Vias."

Dongkeun Oh, Charlie Chung-Ping Chen, Yu Hen Hu (2012)

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DOI: 10.1109/TCAD.2012.2196435

access: closed

type: Journal Article

metadata version: 2020-10-26

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  - https://dblp.org/rec/journals/tcad/OhCH12
Dongkeun Oh, Charlie Chung-Ping Chen, Yu Hen Hu:
Efficient Thermal Simulation for 3-D IC With Thermal Through-Silicon Vias. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31(11): 1767-1771 (2012)

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